By Xavier Aragonès, José Luis González, Antonio Rubio (auth.)
Modern microelectronic layout is characterised through the mixing of complete platforms on a unmarried die. those platforms frequently comprise huge excessive functionality electronic circuitry, excessive answer analog components, excessive riding I/O, and perhaps RF sections. Designers of such structures are continually confronted with the problem to accomplish compatibility in electric features of each part: a few circuitry provides quick transients and big intake spikes, while others require quiet environments to accomplish resolutions way past millivolts. Coupling among these sections is generally unavoidable, because the whole method stocks a similar silicon substrate bulk and a similar package deal. realizing the way in which coupling is produced, and figuring out the right way to isolate coupled circuitry, and the way to use each technique, is then crucial wisdom for each IC clothier.
Analysis and recommendations for Switching Noise Coupling in Mixed-SignalICs is an in-depth examine coupling in the course of the universal silicon substrate, and noise on the strength provide strains. It explains the basic wisdom had to comprehend those phenomena and provides a evaluation of past works and new learn effects. the purpose is to supply an knowing of the explanations for those specific methods of coupling, evaluation and recommend recommendations to noise coupling, and supply standards to use noise aid.
Analysis and recommendations for Switching Noise Coupling in Mixed-SignalICs is a perfect booklet, either as introductory fabric to noise-coupling difficulties in mixed-signal ICs, and for extra complicated designers dealing with this problem.
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Additional resources for Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs
Substrate noise has frequency components in the range of hundreds of megahertz, and thus SOl technology is little attractive both due to its cost and to its limited capacity for reducing noise. 42 T Silicon-on-illsulator technology (SOl) for elimillatillg substrate couplillg. CHAPTER 2. 43 . This silicon island is joined to the rest of the Ie through the interconnects and the oxide, which at the same time acts as an etching stopper. The authors report a circuit with a noise level in the analog section 30 dB above the residual noise, and they manage to eliminate it completely with this technique.
Joardar, "A Simple Approach to Modeling Cross-Talk in Integrated Circuits", IEEE J. SolidState Circuits, vol. 29, no. 10, pp. 1212-1219, Oetober 1994.  I. Rahim, B. Hwang, J. Foerstner, "Comparison of SOl versus Bulk Silicon Substrate Crosstalk Properties for Mixed-Mode IC's", Proc. erence, pp. 171, 1992.  P. Basedau, Q. Huang, "A Post Processing Method for Reducing Substrate Coupling in MixedSignal Integrated Cireuits", Proc. Symposium Oll VLSI Circuits, pp. 41-42,1995.  M. Zuffada, R.
34 Effect of guard rings of increasing length. in a P- substrate without a backplane. o. 10 100 11. 35 Effect of guard rings of increasing length. in a P+ substrate without a backplane. It can be seen that the importance of the length of the guard rings depends on the situation. In all cases, the larger the ring, the lower the noise. lm add little noise reduction, while in P+ wafers the noise reduction is practically linear with the ring length. This confirms what was previously stated about the influence of contacts on noise propagation.